Taiwan Semiconductor Manufacturing Company (TSMC) is set to open a new design centre in Munich by Q3 2025, reinforcing its commitment to Europe's semiconductor ambitions with support for AI, automotive, and IoT industries.

TSMC Sets Sights on Europe with Munich Design Centre

Taiwan Semiconductor Manufacturing Company (TSMC), the world's leading contract chipmaker, has announced plans to open a design centre in Munich by the third quarter of 2025. The move marks a strategic step in the firm’s European expansion, aiming to accelerate innovation across the continent’s vital tech sectors.

Speaking at the 2025 Technology Symposium, TSMC President Paul de Bot confirmed the development, noting that the new centre will bolster European chip design capabilities, especially for emerging industries reliant on high-performance computing.

Munich Design Centre to Fuel AI, Automotive and IoT


The upcoming TSMC Munich Design Centre will focus on supporting European clients with cutting-edge high-density chip designs optimised for performance and energy efficiency. These designs will be targeted at sectors experiencing exponential growth, including automotive systems, artificial intelligence (AI), industrial applications, and the Internet of Things (IoT).

“It is intended to support European consumers with high-density chip design, powerful performance and efficiency for industrial use, in vehicles, in AI and IoT,” de Bot told attendees at the symposium.

The Munich facility is expected to attract top engineering talent and foster collaboration with regional tech firms, reinforcing TSMC’s long-term vision of decentralising semiconductor innovation.

Complementing the Dresden Manufacturing Push


The Munich announcement follows TSMC’s ongoing joint venture in Dresden, where the company is co-developing a semiconductor fabrication plant — the European Semiconductor Manufacturing Company (ESMC) — alongside industry giants Infineon, NXP, and Robert Bosch.

The Dresden plant, set to become a cornerstone of Europe’s semiconductor supply chain, aims to boost local production capacity amid global efforts to reduce reliance on East Asian chip sources. The combined investments in Dresden and Munich underscore TSMC’s commitment to Europe’s semiconductor autonomy and resilience.

A Strategic Move Amid Global Chip Race


As geopolitical tensions and supply chain vulnerabilities continue to shape the global technology landscape, TSMC’s expansion into Germany highlights a broader effort to diversify production and design capabilities across continents.

By reinforcing its footprint in Europe through the Munich Design Centre, TSMC is not only strengthening its ties with European industries but also helping the EU meet its ambitious digital sovereignty targets outlined in the European Chips Act.

With both manufacturing and design arms now firmly planted in Germany, TSMC’s European presence is poised to become a critical force in shaping the next generation of global chip innovation.